Welcome to 2018 International Conference on Materials Science, Mechanical & Electrical Engineering (MSMEE 2018). MSMEE 2018 will be held on June 9-10, 2018, in Tianjin, China.
The aim of MSMEE 2018 is to provide a platform for researchers, engineers, academicians, as well as industrial professionals, to present their research results and development activities in Materials Science, Mechanical & Electrical Engineering. It provides opportunities for the delegates to exchange new ideas and application experiences, to establish business or research relations and to find global partners for future collaboration.
All submissions to the MSMEE 2018 should be written in English via email ICMSMEE@163.com, according to the template, and will be sent to at least two reviewers and evaluated based on originality, technical and research content, relevance to conference, contributions, and readability. The full paper submissions will be chosen based on technical merit, interest, applicability, and how well they fit a coherent and balanced technical program.
All accepted papers from MSMEE 2018 will be published by IOP Press and submitted to CPCI (ISTP), EI (Compendex), Scopus (Elsevier), Inspec for indexing.